Showing results: 16 - 30 of 91 items found.
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MS-177 -
Misum Systech Co., Ltd.
This equipment is used for PCM function test to check thestate ofsingle IC PCM as well as dual IC PCM. It is applied for only 1Cell PCM and can consist ofup to 40 Channels.
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Das Test Haus
Services for ASIC houses and Integrated Device Manufacturers are IC Wafer / Final Test, IC assembly, Test Program development, product engineering, Flash / EEPROM programming, characterisation / capability studies, yield enhancement, design verification and failure / yield analysis. Das Test Haus are specialists for wafer test, low power, mixed signal and eeprom test.
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MASER Engineering B.V.
MASER Engineering has automatic test equipment for the most common ESD test pulse models. MIL - JEDEC - ESDA - IEC standards. IC level Human Body Model. IC level Machine Model. IC level Charged Device Model. System level IEC 61000 HBM. AEC-Q100 Field Induced Gate Leakage test. Static Latch-Up test. Dynamic Latch-Up test.
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UNIVANS Co., Ltd.
IC Package It is a device to install INTERFACE between TESTER and DEVICE during TEST to check electrical defects such as O / S (Open, Short) test, mounting test, BURN-IN TEST and RLC TEST, The device
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LogicVision, Inc.
Mentor’s comprehensive solution for IC test, including best-in-class design-for-test tools and test data analytics that help ensure the highest test coverage, accelerate yield ramp and improve the quality and reliability of manufactured parts.
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Ironwood Electronics
No matter how well designed a circuit is, there is almost always a need to hook up test instruments to it to verify function, look for bugs, or baseline performance. As IC packages become smaller and pin counts grow this becomes harder and harder. probing adapters are required to alleviate this de-bug problem. Many different types of adapters fall into the test and debug category. The common feature is that they bring the signals of an IC out to a format that is easy to interface with test and analysis equipment.
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Japan Electronic Materials Corp.
The probe card is a tool for testing semiconductors used at "Wafer Test" to check quality of IC or LSI in the first process of semiconductor manufacturing. The probe card is expendable.
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Integrated Service Technology -
Integrated Service Technology Inc.
iST (Integrated Service Technology Inc.) is a leading lab-service company, specializing in the development of IC product testing & analysis, failure analysis, debugging, reliability test, material analysis. Apart from developing testing technologies for the upstream IC design and semiconductor industries, iST also expanded to provide a full-spectrum of services for the mid and downstream companies in the electronics industry.
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3380P -
Chroma ATE Inc.
The 3380D/3380P/3380 test system have 4 wires HD VI source and any-pins-to-any-site high parallel test (multi-sites test) functions (512 I/O pins to test 512 ICs in parallel) that can meet the upcoming higher IC testing demands.
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3380D -
Chroma ATE Inc.
The 3380D/3380P/3380 test system have 4 wires HD VI source and any-pins-to-any-site high parallel test (multi-sites test) functions (256 I/O pins to test 256 ICs in parallel) that can meet the upcoming higher IC testing demands.
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TS9000 Family -
Advantest Corp.
The TS9000 series leverages Advantest's industry-leading terahertz analysis technology and expertise amassed over our decades as a global leader in semiconductor test equipment. This system provides a new high-speed, high-precision solution for measurement and analysis tasks including IC chip mold thickness and IC package / printed board wiring quality, which existing methods cannot measure adequately.
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MicroContact AG
Frequently, manual test adapters are required for the functional and IC test. In order to contact the test subject, spring contact probes are often installed in the adapter, but the pitch of the spring contact probes is approx. 1.27 mm and thus too great for certain applications.
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IP TEST HANDLERS SH-5300 & SH-5000 -
MCT, Inc.
MCT’s SH-5300 and SH-5000 are versatile, flexible, high throughput, high parallelism strip test handlers designed to test a wide variety of leaded IC packages at various controlled temperatures, from -55°C to +160°C.
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MICRONICS JAPAN CO.LTD.
U-Probe for Multi-die Test of Memory IC. Vertical-Probe Needle Type Probe card suitable for multi-die test of devices with peripheral pads. ertical-Probe Spring Type. Probe card suitable for area array pad test. 64DUTs Multi-Die. Probe Card for RF devices. Fine Pitch.